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Carrier Board for EDM Type 1 Compact Module : EDM1-GOBLIN | TECHNEXION

Specifications System on Module EDM Type 1 compact form factor Expansion Expansion Slots 2x mini-PCIe + SIM cardslot (for 3G communication) I/O Interfaces Connector 1x SATA 1x micro SD cardslot (SDIO) 2x Gigabit LAN 2x USB 3.0 Host...

Specifications

System on Module

EDM Type 1 compact form factor

Expansion

Expansion Slots

2x mini-PCIe + SIM cardslot
(for 3G communication)

I/O Interfaces

Connector	1x SATA 1x micro SD cardslot (SDIO) 2x Gigabit LAN 2x USB 3.0 Host 1x micro USB 3.0 / 2.0 OTG 1x UART (RS-232/422/485)
Header	2x CAN Bus 1x UART (RS-232) 2x SPI 8x GPIO 2x I2C Manafacturing pins

Video

Connector

1x HMDI
1 channel LVDS 18/24 bit

Audio

Codec	Jumper selectable: Freescale SGTL5000 (I2S), TI TLV320AIC23B (I2S)
Connector	1x 3.5 mm jack Stereo Audio in 1x 3.5 mm jack Stereo Audio out 1x 3.5 mm jack Microphone S/PDIF
Speaker	2W amplified speaker connectors

Touch

Controller	TSC2046 (4 wire by SPI)
Connector	4 wire touch panel

Sensors

Power Specifications

Input Power Requirements	12 VDC +/- 5%
Battery	Smart battery connector

Environmental and Mechanical

Temperature	Commercial : 0° to 60° C Extended : -20° to 70° C Industrial : -40° to 85° C
Humidity	10 - 90%
Module Connector	314 pins MXM3
Form Factor	3.5" Form Factor
Dimensions	147 x 102 mm 5¾ x 4 inch
MTBF	>100,000 hours
Weight	115 grams
Shock	50G / 25ms
Vibration	20G / 0-600 Hz
Certification	Compliant with CE, FCC, RoHS, REACh directives

CPU	EDM Type 1 compliant

CPU	EDM Type 1 compliant