Description
Caractéristiques :
- Équipements de fabrication avancés et dispositifs de test de fiabilité, assurant une excellente qualité et fiabilité des PCB ;
- Haute cohérence du THP, haute cohérence de l'impédance caractéristique grâce à l'introduction de dispositifs de mesure d'impédance à tolérance serrée ;
- Haute précision de perçage et bonne forme du trou de perçage, Max. AR 8:1 est possible.
Applications :
- Wi-Fi, Bluetooth, module de communication 3G/4G etc. st carte de trou d'ampoule ;
- Electronique grand public, comme les téléviseurs LCD, les décodeurs, etc ;
- Terminaux de communication, tels que les téléphones mobiles, les MID, etc ;
- Instrument électronique industriel, automobile, etc.
Références et spécifications :
| Categories |
Application |
| Stamp Hole Module Board （HDI or Through-hole) |
Wi-Fi module, Bluetooth module, etc. |
| HDI Board (4, 6, 8 Layers etc. ) |
| Through-hole Board (4, 6, 8 Layers etc. ) |
Communication End, such as Mobile phone, MID etc.
Consummer electronics, such as LCD-TV, STB, etc.; |
Spécifications techniques :
| Min. Stamp Hole Aperture |
12mil(0.3mm) |
10mil(0.25mm) |
| Min.VIA Hole Size |
8mil (0.200mm) |
5mil (0.150mm) |
| Min. Blind Hole Size |
4mil (0.1mm) |
3mil (0.076mm) |
| Line Width/Space |
2.5mil (0.063mm) |
2mil (0.05mm) |
| Line Width/Space Accuracy |
+/-20% |
+/-10% |
| PTH Aperture Size Accuracy |
+/-3mil (0.075mm) |
+/-2mil (0.050mm) |
| NPTH Aperture Size Accuracy |
+/-2mil (0.050mm) |
+/-1mil (0.025mm) |
| Hole Location Accuracy |
+/-3mil (0.075mm) |
+/-2mil (0.050mm) |
| Hole to side Accuracy |
+/-4mil (0.100mm) |
+/-3mil (0.075mm) |
| Side to Side Accuracy |
+/-4mil (0.1mm) |
+/-3mil (0.075mm) |
| Layer to Layer Registration Accuracy |
+/-4mil (0.100mm) |
+/-3mil (0.075mm) |
| Impedance Accuracy |
+/-10% |
+/-7% |
| Board Twist |
Max. 0.75% |
Max. 0.5% |
| Through-hole Multilayer Board Capability |
4-16 Layers, Board Thickness: 12mil-90mil (0.30mm-2.4mm) |
| Blind/Buried Hole Capability |
4-16 Layers, Board Thickness: 12mil-90mil (0.30mm-2.4mm) |
| HDI Capability |
3+N+3 |
| Primary Material Supplier |
Shengyi & EMC & ITEQ |
| Environmental Production |
ROHS, Halogen-Free Compliant Through-hole Multilayer Board and HDI Board |
| Surface Finish |
OSP: Entek Plus Ht, Preflux F2 Lx(0.2-0.5μm) |
Ni:100～250μin(2.54-6.25μm)
Au/Ni Immersion: 1~ 5μin(0.03-0.125μm); |
OSP: Entek Plus Ht, Preflux F2 Lx(0.2-0.5μm) Ni:100～250μin(2.54-6.25μm)
Au/Ni Immersion: 1~ 5μin(0.03-0.125μm); |
| Max Production Board Size |
21.5"×24.5"(546mm×622mm) |
| Max Aspect Ratio |
8:1 |
